ACCELONIX – Métrologie Thermal Warpage

ACCELONIX – Métrologie Thermal Warpage

·       Akrometrix manufactures metrology equipment for thermal warpage & strain measurement & analysis over a temperature profile

·       Can measure warpage on any type substrate (wafers, wafers on film frame, die, components, packages, die in package, bare boards, populated boards,& pcb’s – virtually any substrate

·       Provides test services for thermal warpage and strain measurements.

·       Utilizes Shadow Moiré and Digital Fringe Projection (DFP) for warpage metrology

·       Utilizes Digital Image Correlation (DIC) for x-y strain metrology

·       Headquartered in Atlanta, Georgia, USA

·       Over 350 systems installed worldwide

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