ACCELONIX – Métrologie Thermal Warpage
· Akrometrix manufactures metrology equipment for thermal warpage & strain measurement & analysis over a temperature profile
· Can measure warpage on any type substrate (wafers, wafers on film frame, die, components, packages, die in package, bare boards, populated boards,& pcb’s – virtually any substrate
· Provides test services for thermal warpage and strain measurements.
· Utilizes Shadow Moiré and Digital Fringe Projection (DFP) for warpage metrology
· Utilizes Digital Image Correlation (DIC) for x-y strain metrology
· Headquartered in Atlanta, Georgia, USA
· Over 350 systems installed worldwide